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D&H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry
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CCD Vision Dispensing System

Glue Dispenser

Spraying Glue Machine

High Precision Dispensing Valve

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PU Dispensing Machine
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Ms. Yolanda Zhou
dh02@dahengkongjiao.com
86--18926136909
wechat 8613535032180
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D&H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry
  • name

D&H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry

MOQ: 1
Standard Packaging: standard wood case
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
D&H
Certification
ce
Model Number
GOB
Highlight:

Modular GOB Bonding Equipment

,

Energy Saving GOB Bonding Equipment

,

Electronics Industry GOB Bonding Equipment

Product Description
D&H GOB Lamination Production Line
——Tailored Solutions for Precision LED Manufacturing

----------------------------------------------------------------------------------------------------------------------------------

Overview
The D&H GOB (Glue on Board) Encapsulation Production Line offers fully customization solutions to meet diverse industrial needs, combining advanced encapsulation technology with modular design. Our production line prioritizes flexibility, enabling adjustment in size, mold configurations, software integration, and process parameters to align with specific client requirements.
 
Customizable Services

1. Production Line Dimensions
a. Scalable layouts to fit factory spaces ranging from compact workshops to large-scale facilities.
b. Adjustable conveyor widths (e.g., 500–2000 mm) and modular station placements for seamless integration with existing workflows.


2. Mold & Tooling Customization
a. Material Compatibility: Molds compatible with nano-grade adhesives, UV-resistant resins, or specialty coatings for
b.anti-glare/anti-static finishes.
c. Precision Design: Custom cavity shapes and surface textures (matte/gloss) to optimize encapsulation uniformity.


3. Software & Automation
a. Programmable Logic Control (PLC): Tailored dispensing algorithms for variable glue thickness and curing cycles.
b. AI-Driven Quality Monitoring: Real-time defect detection (<0.01% error rate) via adaptive AOI systems and predictive
maintenance alerts.


4. Process Parameters
a. Adjustable plunger pump pressure, flow rates, and nozzle configurations to accommodate low/high-viscosity adhesives.
b. Custom IP rating protocols and environmental stress-testing workflows.



----------------------------------------------------------------------------------------------------------------------------------

Applications
Ideal for bespoke projects requiring:
✔ High-mix, low-volume LED displays
✔ Specialized environments with strict durability standards.
Company Profile
D&H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry 0
D&H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry 1
D&H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry 2
D&H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry 3
Certifications
D&H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry 4
Why Choose Us
D&H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry 5
Tags: 

epoxy glue potting machine,  

electric glue potting machine,  

automatic glue potting machine

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products
PRODUCTS DETAILS
Products

Glue Potting Machine

Glue Dispensing Machine

Glue Mixing Machine

Meter Mix Dispensing Machine

Vacuum Potting Casting Machine

CCD Vision Dispensing System

Glue Dispenser

Spraying Glue Machine

High Precision Dispensing Valve

Epoxy Doming Machine

PU Dispensing Machine
D&H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry
  • name
D&H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry
MOQ: 1
Standard Packaging: standard wood case
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
D&H
Certification
ce
Model Number
GOB
Minimum Order Quantity:
1
Packaging Details:
standard wood case
Highlight

Modular GOB Bonding Equipment

,

Energy Saving GOB Bonding Equipment

,

Electronics Industry GOB Bonding Equipment

Product Description
D&H GOB Lamination Production Line
——Tailored Solutions for Precision LED Manufacturing

----------------------------------------------------------------------------------------------------------------------------------

Overview
The D&H GOB (Glue on Board) Encapsulation Production Line offers fully customization solutions to meet diverse industrial needs, combining advanced encapsulation technology with modular design. Our production line prioritizes flexibility, enabling adjustment in size, mold configurations, software integration, and process parameters to align with specific client requirements.
 
Customizable Services

1. Production Line Dimensions
a. Scalable layouts to fit factory spaces ranging from compact workshops to large-scale facilities.
b. Adjustable conveyor widths (e.g., 500–2000 mm) and modular station placements for seamless integration with existing workflows.


2. Mold & Tooling Customization
a. Material Compatibility: Molds compatible with nano-grade adhesives, UV-resistant resins, or specialty coatings for
b.anti-glare/anti-static finishes.
c. Precision Design: Custom cavity shapes and surface textures (matte/gloss) to optimize encapsulation uniformity.


3. Software & Automation
a. Programmable Logic Control (PLC): Tailored dispensing algorithms for variable glue thickness and curing cycles.
b. AI-Driven Quality Monitoring: Real-time defect detection (<0.01% error rate) via adaptive AOI systems and predictive
maintenance alerts.


4. Process Parameters
a. Adjustable plunger pump pressure, flow rates, and nozzle configurations to accommodate low/high-viscosity adhesives.
b. Custom IP rating protocols and environmental stress-testing workflows.



----------------------------------------------------------------------------------------------------------------------------------

Applications
Ideal for bespoke projects requiring:
✔ High-mix, low-volume LED displays
✔ Specialized environments with strict durability standards.
Company Profile
D&H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry 0
D&H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry 1
D&H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry 2
D&H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry 3
Certifications
D&H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry 4
Why Choose Us
D&H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry 5
Tags: 

epoxy glue potting machine,

electric glue potting machine,

automatic glue potting machine

Guangzhou Zhengqi Technology Co., Ltd.
Room 402, 4th Floor, Building B3, Liandong U Valley Huangpu Science and Technology Headquarters Port, No. 9, Xicheng South Street, Huangpu District, Guangzhou City, Guangdong Province.
Tel: 13535032180
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